激光焊接

激光焊接

激光焊接技术的主要优势是在精准控制下可达到高度灵活性.

所有的工艺参数,比如能量摄入,激光光斑大小以及控制类参数等,都可以针对每个焊点量
身设定,因此即使在极具挑战的焊接情况下也可达到完美的连接.

激光焊接常被应用于具有挑战的焊接情况,比如温度敏感的部件,极小或者用传统焊接技术
难到达的焊点。(如回流焊或者波峰焊).

我们愿以十五年以上的激光技术经验来支持您的焊接应用。欢迎联系我们,以提供针对您的
有关焊接工艺的专业深度咨询.

高亮度二极管激光器 搭配激光加工控制系统LASCON的使用,能使您在关键环节掌控您的
焊接过程——实时把温度控制在理想设定的数值。

非接触式焊接 可调整的激光光斑大小,最小直径可达100μm
局部,精准的能量摄入 精准的温度控制
在线质量监控 100% 可重复性,可追踪性
便于自动化 极低维护成本

激光焊接常被用于电子企业,来完成SMD,THT以及PCB等的焊接,也可用于光电企业的太
阳能电池生产.

下图展示了由激光加工控制系统LASCON监视并控制的焊接工艺曲线.

图中的绿色曲线代表目标工艺温度(设定值)。红色曲线代表由集成在激光头上面的高频测
温传感器测得的焊点实时实际温度。而黑色曲线则是以百分比为单位的激光实时能量输出,
以时刻调整实际温度接近目标温度。

该控制系统的处理频率可达10 kHz,这使得实时控制成为可能。正如您在图表中可以清晰看
见的一样,在整个加工过程的三个阶段中,焊点处的实际温度总能和目标温度十分接近(预
热,送丝焊接,焊点润湿成型)。

Initially, the pad is preheated to a temperature of 300°C. After 1 second, LASCON® switches on the solder wire feeder. The solder wire feeder is switched off after approx 1.4 s. The Soldering temperature is controlled throughout the process and kept at the optimum preselected level. Laser power output varies, controlled by the laser process controller LASCON to attain the right process temperature.

The soldering process can be monitored on-line and controlled via preset process quality parameters, allowing an automatic pass/fail quality decision to be made.

As an alternative to welding with tin solder wire, laser soldering with soldering paste is also possible. The paste must be applied with a dispenser. Squirting is largely prevented due to an optimized temperature program.

Various points can be warmed up simultaneously or in succession using scanners

Flex foil

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Through hole

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Strand

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Press release ( in german ) for selective laser soldering in Productronic Magazine

-Zielgenau Laserlöten – PDF 193 kB-Zielgenau Laserlöten – PDF 193 kB